Boyang Yang | Yanshan University

About Me

I am an Assistant Professor (from 2026) at Yanshan University, and CTO (from 2015) of Beijing Jisuanke Co., Ltd. I obtained Ph.D. (2026) from Yanshan University under the supervision of Prof. Shunfu Jin and Prof. Haoye Tian. Before that, I obtained bachelor (2013) and master (2018) degree from Beihang University during industry working, under the supervision of Prof. Zhoujun Li. I am a Senior Member of IEEE and CCF, and an external supervisor at Wuhan University. I represented Beihang University in the ACM International Collegiate Programming Contest (ICPC) World Finals and achieved 27th place. I have published 6 papers in the Research Track of top-tier venues (ICSE, TOSEM, ISSTA), 3 of which I am the first author. I have served as a Program Committee member for FSE’26 IVR, ICSME’26 Industry, ICST’26, MSR’26, and AIware’26, and served as a reviewer for the journal EMSE, ASEJ, TOSEM, TSE and TAAS.

Research Interests

AI4SE
Program Repair
NLP

News

[April, 2026] One paper was accepted by ISSTA’26.
[March, 2026] Invited as a reviewer of TAAS.
[Feb, 2026] Invited as a Program Committee of FSE’26 IVR Track.
[Jan, 2026] Invited as a reviewer of the EMSE, ASEJ, TOSEM, and TSE.
[Jan, 2026] Invited as a Program Committee of ICST’26 and AIware Research Track.
[Dec, 2025] One paper was accepted by ICSE’26.
[Dec, 2025] Successfully defended my Ph.D. dissertation.
[Nov, 2025] Invited as a Program Committee of ICSME’26 Industry Track.
[Oct, 2025] One paper was accepted by ICSE’26.
[Sept, 2025] One paper was accepted by ASE’25 Journal First Track.
[Sept, 2025] Invited as a Program Committee of MSR’26 Research Track and Industry Track.
[June, 2025] Invited as a reviewer of NeurIPS’25 and ACL’25.
[May, 2025] Two paper were accepted by TOSEM.
[Jul, 2024] One paper was accepted by ISSTA’24.

Publications

HELO-APR: Enhancing Low-Resource Program Repair through Cross-Lingual Knowledge Transfer

Zhipeng Wang, Boyang Yang, Yidong Wan, Liuye Guo, You Lv, Tao Zheng, Zhuowei Wang, Tieke He

35th ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA 2026)

Input Reduction Enhanced LLM-based Program Repair

Boyang Yang, Luyao Ren, Xin Yin, Jiadong Ren, Haoye Tian, Shunfu Jin

IEEE/ACM International Conference on Software Engineering, 2026.

PDF

Unlocking LLM Repair Capabilities Through Cross-Language Translation and Multi-Agent Refinement

Wenqiang Luo, Jacky Wai Keung, Boyang Yang, Jacques Klein, Tegawende F Bissyande, Haoye Tian, Bach Le

IEEE/ACM International Conference on Software Engineering, 2026.

PDF

MORepair: Teaching LLMs to Repair Code via Multi-Objective Fine-tuning

Boyang Yang, Haoye Tian, Jiadong Ren, Hongyu Zhang, Jacques Klein, Tegawendé F Bissyandé, Claire Le Goues, Shunfu Jin

ACM Transactions on Software Engineering and Methodology, 2025.

PDF Code Project Page

When Fine-Tuning LLMs Meets Data Privacy: An Empirical Study of Federated Learning in LLM-Based Program Repair

Wenqiang Luo, Jacky Keung, Boyang Yang, He Ye, Claire Le Goues, Tegawende F Bissyande, Haoye Tian, Xuan Bach D Le

ACM Transactions on Software Engineering and Methodology, 2025.

PDF Code

CREF: An LLM-based Conversational Software Repair Framework for Programming Tutors

Boyang Yang, Haoye Tian, Weiguo Pian, Haoran Yu, Haitao Wang, Jacques Klein, Tegawendé F Bissyandé, Shunfu Jin

33rd ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA), 2024.

PDF Code Project Page

Services

Conference Reviewers

Academic Positions

Senior Member of IEEE and CCF
Academic Committee member of YOCSEF (Baoding)and CTO Club, CCF
External Lecturer at Wuhan University