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Boyang Yang, Zijian Cai, Fengling Liu, Bach Le, Lingming Zhang, Tegawendé F. Bissyandé, Yang Liu, Haoye Tian
TOSEMCCF-AACM Transactions on Software Engineering and Methodology, 2026.
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Yingjian Xiao, Weiwei Gong, Jianjun Huang, Rongqun Hu, Hongwei Li, Anquan Jie, Boyang Yang
IJSEKECCF-CInternational Journal of Software Engineering and Knowledge Engineering, 2026.
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HELO-APR: Enhancing Low-Resource Program Repair through Cross-Lingual Knowledge Transfer
Zhipeng Wang, Boyang Yang, Yidong Wan, Liuye Guo, You Lv, Tao Zheng, Zhuowei Wang, Tieke He
ISSTACCF-A35th ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA 2026)
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Boyang Yang, Luyao Ren, Xin Yin, Jiadong Ren, Haoye Tian, Shunfu Jin
ICSECCF-AIEEE/ACM International Conference on Software Engineering, 2026.
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Wenqiang Luo, Jacky Wai Keung, Boyang Yang, Jacques Klein, Tegawende F Bissyande, Haoye Tian, Bach Le
ICSECCF-AIEEE/ACM International Conference on Software Engineering, 2026.
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Boyang Yang, Haoye Tian, Jiadong Ren, Hongyu Zhang, Jacques Klein, Tegawendé F Bissyandé, Claire Le Goues, Shunfu Jin
TOSEM & ASE-Journal First TrackCCF-AACM Transactions on Software Engineering and Methodology, 2025.
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Wenqiang Luo, Jacky Keung, Boyang Yang, He Ye, Claire Le Goues, Tegawende F Bissyande, Haoye Tian, Xuan Bach D Le
TOSEMCCF-AACM Transactions on Software Engineering and Methodology, 2025.
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Boyang Yang, Haoye Tian, Weiguo Pian, Haoran Yu, Haitao Wang, Jacques Klein, Tegawendé F Bissyandé, Shunfu Jin
ISSTACCF-A33rd ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA), 2024.