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Boyang Yang

Assistant Professor
Yanshan University
yby@ieee.org


Publications

Publications

  1. HELO-APR: Enhancing Low-Resource Program Repair through Cross-Lingual Knowledge Transfer
    Zhipeng Wang, Boyang Yang, Yidong Wan, Liuye Guo, You Lv, Tao Zheng, Zhuowei Wang, Tieke He
    35th ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA 2026)

  2. Input Reduction Enhanced LLM-based Program Repair
    Boyang Yang, Luyao Ren, Xin Yin, Jiadong Ren, Haoye Tian, Shunfu Jin
    IEEE/ACM International Conference on Software Engineering, 2026.
    PDF

  3. Unlocking LLM Repair Capabilities Through Cross-Language Translation and Multi-Agent Refinement
    Wenqiang Luo, Jacky Wai Keung, Boyang Yang, Jacques Klein, Tegawende F Bissyande, Haoye Tian, Bach Le
    IEEE/ACM International Conference on Software Engineering, 2026.
    PDF

  4. MORepair: Teaching LLMs to Repair Code via Multi-Objective Fine-tuning
    Boyang Yang, Haoye Tian, Jiadong Ren, Hongyu Zhang, Jacques Klein, Tegawendé F Bissyandé, Claire Le Goues, Shunfu Jin
    ACM Transactions on Software Engineering and Methodology, 2025.
    PDF Code Project Page

  5. When Fine-Tuning LLMs Meets Data Privacy: An Empirical Study of Federated Learning in LLM-Based Program Repair
    Wenqiang Luo, Jacky Keung, Boyang Yang, He Ye, Claire Le Goues, Tegawende F Bissyande, Haoye Tian, Xuan Bach D Le
    ACM Transactions on Software Engineering and Methodology, 2025.
    PDF Code

  6. CREF: An LLM-based Conversational Software Repair Framework for Programming Tutors
    Boyang Yang, Haoye Tian, Weiguo Pian, Haoran Yu, Haitao Wang, Jacques Klein, Tegawendé F Bissyandé, Shunfu Jin
    33rd ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA), 2024.
    PDF Code Project Page


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