avatar

Boyang Yang

Assistant Professor
Yanshan University
yby@ieee.org


Publications

  1. Boyang Yang, Zijian Cai, Fengling Liu, Bach Le, Lingming Zhang, Tegawendé F. Bissyandé, Yang Liu, Haoye Tian
    TOSEMCCF-AACM Transactions on Software Engineering and Methodology, 2026.
  2. Yingjian Xiao, Weiwei Gong, Jianjun Huang, Rongqun Hu, Hongwei Li, Anquan Jie, Boyang Yang
    IJSEKECCF-CInternational Journal of Software Engineering and Knowledge Engineering, 2026.
  3. HELO-APR: Enhancing Low-Resource Program Repair through Cross-Lingual Knowledge Transfer
    Zhipeng Wang, Boyang Yang, Yidong Wan, Liuye Guo, You Lv, Tao Zheng, Zhuowei Wang, Tieke He
    ISSTACCF-A35th ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA 2026)
  4. Boyang Yang, Luyao Ren, Xin Yin, Jiadong Ren, Haoye Tian, Shunfu Jin
    ICSECCF-AIEEE/ACM International Conference on Software Engineering, 2026.
  5. Wenqiang Luo, Jacky Wai Keung, Boyang Yang, Jacques Klein, Tegawende F Bissyande, Haoye Tian, Bach Le
    ICSECCF-AIEEE/ACM International Conference on Software Engineering, 2026.
  6. Boyang Yang, Haoye Tian, Jiadong Ren, Hongyu Zhang, Jacques Klein, Tegawendé F Bissyandé, Claire Le Goues, Shunfu Jin
    TOSEM & ASE-Journal First TrackCCF-AACM Transactions on Software Engineering and Methodology, 2025.
  7. Wenqiang Luo, Jacky Keung, Boyang Yang, He Ye, Claire Le Goues, Tegawende F Bissyande, Haoye Tian, Xuan Bach D Le
    TOSEMCCF-AACM Transactions on Software Engineering and Methodology, 2025.
  8. Boyang Yang, Haoye Tian, Weiguo Pian, Haoran Yu, Haitao Wang, Jacques Klein, Tegawendé F Bissyandé, Shunfu Jin
    ISSTACCF-A33rd ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA), 2024.

Powered by Jekyll theme.